SHELLBACK Semiconductor Technology's EAGLEi 300 FOUP Inspection System
SHELLBACK Semiconductor Technology has sold its EAGLEi 300 FOUP Inspection System to US 300mm chip manufacturer. The capital equipment solutions provider claims its customer is an industry-leading global electronics manufacturer, with the sale also highlighting the demand for EAGLEi technology within tolerance enter production.
Key information:
- SHELLBACK sells EAGLEi 300 FOUP Inspection System to a US 300mm chip manufacturer.
- The company claims that the sale proves the importance of the EAGLEi technology within tolerance enter production.
- The EAGLEi 300 aims to improve both accuracy and fab yield levels.
According to the developers, the EAGLEi 300 helps set the benchmark for precise pre and post-clean carrier measurement evaluation and is used in prominent 300mm fabs all around the world. The system aims to improve fab yield through its accurate, programmable multipoint wafer carrier inspection.
"Over the past 3 years, EAGLEi300 has become the standard for 300mm foundries and high-volume manufacturers throughout Asia,” said Wayne Jeveli, CEO of SHELLBACK Semiconductor Technology. “We're thrilled to see major North American customers benefiting from our best-in-class inspection technology as they invest in capacity expansions and new fab construction. Well known as the most accurate carrier inspection system available today, EAGLEi is an obvious choice to improve fab yield."
The EAGLEi 300 can provide automated 300mm FOUP and FOSB wafer carrier inspection, compared to its counterpart the EAGLEi 200, which is available for 2" to 200mm wafer cassette and carrier inspection.