Onto Innovation's Dragonfly G3 sub-micron 2D/3D inspection and metrology system
Onto Innovation has unveiled the new sub-surface inspection capability of its Dragonfly G3 sub-micron 2D/3D inspection and metrology platform. The innovation aims to protect yields by offering whole wafer inspection with the hope of minimising defects that can lead to yield or die loss.
As wafer thinning and multi-layer wafer or die bonding continue to become more prevalent, the potential danger for sub-surface defects continues to grow. Thinner wafer layers make them more brittle and suspectable to damage either pre-bonding or post-bonding. If this were to occur, issues like micro-cracks can lead to either die yield issues or even the shattering of a wafer resulting in the loss of hundreds of die instantaneously.
With the latest development, the Dragonfly platform can detect these yield-killing defects at production speeds. The solution does this by utilising infrared (IR) technology with specialised algorithms to perform a scan of the entire wafer. Overall positives this should bring include reduced waste, improved cost savings, and enhanced final yield numbers.
“Customers are demanding 100% inspection capability with production-worthy throughput,” said Mayson Brooks, Vice President and General Manager of Onto’s inspection business. “The Dragonfly G3 system’s new high-speed IR capability delivers just that, combined with the flexibility to select from multiple objective lenses allowing customers to inspect at different magnifications for different applications and devices.”
“The Dragonfly G3 system with its enhanced sub-surface defect detection builds upon the previous model’s successful adoption by HBM customers for die position metrology on stacked dies and wafers,” concludes Brooks.