Hand-out NADA Technologies, Inc.
NADAtech Inline wafer sorter
NADAtech Inline Wafer Sorter
NADA Technologies has unveiled its fully automated solution for 150/200 and 300mm Wafer Bow Warp measurement. The new module claims to meet customer’s target specifications at a reduced price compared to its competitors, while also improving throughput.
Key information:
- NADA Technologies has announced its automated solution for 150/200 and 300mm Wafer Bow Warp measurement.
- The new module aims to provide a cost-effective solution for customers that also improves throughput and maintains high levels of accuracy.
- According to the tailored wafer sort solutions provider, the new release can measure total thickness variations, bow, warp, and voids during a single scan.
NADAtech has previously made a name for itself for engineering dual and triple functionality into its automation solutions, with the aim of increasing capacity and yield, yet decreasing equipment footprint. The company’s latest release, the Bow Warp add-on, continues this trend.
"We are so excited to bring this new technology to market,” said Tim Ewald, CEO of NADAtech. “There has been significant interest in this new platform from multiple customers and shipments have already begun in 2023. This system will open new markets to NADAtech while offering far greater efficiency to our customers.”
According to its developers, the new module utilises an optical tomography sensor to measure total thickness variations, bow, warp, and voids. This takes place during a single scan that only takes seconds to complete, while also ensuring high levels of accuracy.
The module works by taking measurements from one side of the wafer, with the system able to take measurements of an entire 12" wafer made from any material. Once added to NADAtech’s T-Series wafer sorter, the AOI capabilities provide the user with a competitive advantage in measurement, inline inspection, and quality control, as up to three other recipes can be run at the same time.