Automation Technology XCS series
Automation Technology (AT) has launched its new 3D sensor, part of the XCS series, for high-performance applications within the electronics industry. This is a key development, as ensuring the accuracy of the smallest details can make the difference between success and failure within the semiconductor industry.
According to AT, “The most important feature of the XCS series laser is the homogeneous thickness along the laser line thanks to the laser projector’s special optics. The homogeneous line thickness enables precise scanning of the smallest structures – regardless of whether the object to be scanned is in the middle or at the edge of the line.” This benefits the user as it allows for the inspection of applications with high repeatability and enhanced accuracy.
Key features of AT’s new 3D sensor:
- Field of view of up to 2.08 in (53 mm).
- Increased inspection speeds (of up to 140 kHz) with the 3070 WARP sensor variant.
- Features homogeneous thickness along the laser line.
- Includes Clean Beam function which protects the laser from external interference factors (e.g., optical anomalies).
- The dual-head option delivers unique 3D scanning results.
Another important element of the new solution is that it features the Clean Beam function which was developed by AT. This will ensure that the laser is protected from external interference factors like optical anomalies, allowing for the laser beam to remain extremely precise and focused. Additionally, Clean Beam provides uniform intensity distribution which can ensure reliable and consistent results.