Onto Innovation Firefly G3 system
Onto Innovation has launched its glass substrate suite featuring the JetStep X500 panel-level packaging lithography system with hybrid substrate handling capabilities. The process control specialist also unveiled its Firefly G3 sub-micron automatic metrology and inspection system, which can be utilised in panel-level packaging and advanced IC substrates (AICS).
Both systems will offer users a complete panel-level packaging solution that supports heterogeneous integration (HI) chiplet packages for artificial intelligence (AI), high-performance compute, and cloud computing.
“The hybrid substrate handling capabilities of the JetStep X500 system demonstrate Onto Innovation’s commitment to continually improving our portfolio of panel-level products to meet cutting-edge technological advances,” said Jason Robinson, Vice President and General Manager of Onto’s lithography business. “With the capability for sub-1.5µm l/s RDL resolution and the ability to expose panel areas of up to 250mm x 250mm in one shot, the JetStep series delivers an advanced packaging solution that meets the needs of today’s organic substrates and the glass substrates powering the next evolution in highly advanced HI packages.”
The production of glass substrates results in the generation of several significant process control challenges, which can lead to defects, typically caused by handling through glass via (TGV) formation, and the Cu plating process. In order to improve the user’s ability to focus on TGV formation, they will require 3D metrology solutions to complete tasks like measuring via-to-via distance and via diameter for the top, waist, and bottom.
Utilising illumination techniques like Onto’s Clearfield technology, the Firefly G3 system can be used as an inspection tool for organic panels. By applying these techniques to glass panels, Onto can provide a unique inspection solution for bare and pattered glass substrates.
Key features of the Firefly G3 System:
- Identifies chips and cracks and inspects defects like dimples.
- Performs TVG metrology for vias, including finding the X and Y displacements of TGVs within minutes.
- The system’s 3D metrology sensors for dielectric thickness measurements allow customers to achieve proper copper plating height uniformity for RDLs.
“The Firefly G3 system is capable of supporting a range of panels and substrate types with sensitivity below 1µm, making it an extremely versatile investment for our customers,” said Mayson Brooks, Vice President and General Manager of Onto’s inspection business. “That versatility has led to a broad range of customers selecting the Firefly G3 system, along with the JetStep X500, for their next expansions, further positioning Onto Innovation for continued growth in the advanced packaging panel-level packaging market.”