EV Group to showcase latest high volume manufacturing innovations at SEMICON Taiwan

“Over the years, EVG has significantly expanded its presence in Taiwan to better meet the growing needs and challenges that our customers and partners in the region face.”

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EV Group (EVG) will be exhibiting its latest innovations within the fields of hybrid and fusion wafer bonding, infrared (IR) laser layer release technology, and lithography for advanced semiconductor and micro-electronics manufacturing and packaging at SEMICON Taiwan 2024.

The company aims to provide high-volume manufacturing-ready process solutions and engineering services to help customers find new ways to build semiconductors and innovate design and chip integration schemes. The latter may specifically focus on technologies like high bandwidth memory, backside power distribution networks, chiplets and more.

“Taiwan is a crucial epicentre for the semiconductor industry, producing more than 60 percent of the world’s semiconductors, and about 90% of the most advanced-node devices. As such, it is important for EVG to have a strong presence at SEMICON Taiwan,” said Dr Thorsten Matthias, Regional Sales Director, Asia/Pacific, at EV Group. “Over the years, EVG has significantly expanded its presence in Taiwan to better meet the growing needs and challenges that our customers and partners in the region face. This year, we have taken additional steps for continued growth and long-term customer commitment in Taiwan in the years to come.”

EVG at SEMICON Taiwan

During the SEMICON Taiwan event, EVG is set to present on the two following topics:

  1. “Maskless Patterning Solution for Multi-functional Chiplets in Advanced System-in-Package (SiP)” (TechXPOT – Wednesday, September 4, 2:00pm at Stage 4F, TaiNEX 1, Booth L1200). This will be presented by Kuo Yin-Chuan, Process Technology Engineer at EV Group Taiwan Ltd. This will focus on EVG’s maskless exposure system, LITHOSCALE.
  2.  “Disruptive 3D Integration Technologies for Advanced Stacked Systems” (Heterogeneous Integration Global Summit– Friday, September 6, 2:25pm at Room 701GH, 7th Floor, TaiNEX 2). Thomas Uhrmann, Director of Business Development at EVG, will present an overview of current industry trends and technological developments for both wafer-to-wafer and die-to-wafer hybrid bonding.

If you are attending SEMICON Taiwan (September 4-6), you will find EVG at booth L0316.