EV Group
The EVG 880 LayerRelease system is a dedicatwd HVM equipment platform.
The EVG®880 LayerRelease™ system is a dedicated HVM equipment platform incorporating EVG’s innovative IR LayerRelease™ technology, providing a two-fold increase in throughput compared to the previous-generation platform. Source: EV Group.
EV Group has unveiled its EVG880 LayerRelease System, which utilises the wafer bonding specialist’s infrared (IR) LayerRelease technology. The high-volume manufacturing (HVM) equipment platform claims to provide a two-fold increase in throughput compared to its predecessors.
Using an IR laser with formulated inorganic release materials, the EVG880 system works by enabling the nanometre precision release of bonded, deposited, or grown layers from silicon carrier substrates. As a result, the need for glass carriers is eliminated. Instead, advanced packaging like ultra-thin chiplet stacking can occur, as well as ultra-thin 3D layer stacking for front-end processing.
“3D integration is increasingly important in optimising the Power, Performance, Area and Cost (PPAC) metric in semiconductor design and manufacturing, as well as enabling roadmap continuation,” said Paul Lindner, Executive Technology Director at EV Group. “With 3D integration, there is no way around wafer bonding or layer transfer. EVG's LayerRelease technology is a truly unique and universal layer transfer technology that has been adopted by industry-leading research institutes and device manufacturers to support a wide range of applications, from advanced packaging to 3D integration to future front-end-of-line scaling.”
Lindner continued, “As early adopters of our LayerRelease technology are expected to move quickly from industrial research to manufacturing, EVG has increased its focus on improving the technology's productivity and cost of ownership. We are excited to now be able to offer this innovative technology on our new EVG880 HVM equipment platform, enabling customers to rapidly deploy the LayerRelease process for their current and next-generation product designs.”
Key features of the EVG880 LayerRelease system:
- An all-in-one tool with integrated laser exposure, wafer cleaving, and wafer cleaning.
- Designed for the LayerRelease process.
- Fully automated.
- Front-end compatible system.
- High-temperature compatibility of up to 1000°C.
The EVG880 LayerRelease system works by utilising its IR laser and inorganic release materials to allow for laser debonding on silicon carriers with nanometre precision within production environments. This helps avoid temperature and glass carrier compatibility issues. With nanometre precision, the system can process extremely thin device wafers without having to change processes.