Semiconductor Digest's Editor-in-Chief Peter Singer handing over the award to EVG's Executive Sales & Customer Support Director Hermann Waltl.
EV Group (EVG) has won the Best of West award for its EVG880 LayerRelease system. The company received its prize at SEMICON West 2024 in San Francisco. The Best of West award recognises new, innovative products or services that can advance the electronics manufacturing supply chain or a particular manufacturing capability.
“The EVG 880 LayerRelease system enables an important step forward for 3D integration,” said Pete Singer, Editor-in-Chief of Semiconductor Digest. “Congratulations to EV Group for again winning the Best of West competition.”
According to its developers, the EVG800 LayerRelease system is the first high-volume manufacturing equipment platform which incorporates EVG’s LayerRelease technology. The solution works by enabling the nanometre-precision release of bonded, deposited or grown layers from silicon carrier substrates. To do this, EVG880 utilises an infrared (IR) laser with specially formulated inorganic release materials.
This solution aims to eliminate the need for a glass carrier, allowing for ultra-thin chiplet stacking for advanced packaging. Additionally, ultra-thin 3D layer stacking is now possible for front-end processing. This allows for shorter distances between stacked dies, which reduces power consumption and improves productivity levels.
Previously, EVG won the same award for its LITHOSCALE Maskless Exposure System in 2021.