Delta and subsidiary Universal Instruments reveal innovations in AI-based automation and digital twin technologies

“Our rapid advancement in AI and digital twin technologies enable the seamless integration of front-end and back-end processes, ultimately ensuring the reliability and optimal performance of our customers' equipment and operations.”

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Delta, and its US-based subsidiary Universal Instruments, unveiled a series of digital twin and AI-based automation-enabled semiconductor manufacturing solutions at SEMICON Taiwan. The three new solutions include:

  • DIATwin Virtual Machine Development Platform – Increases product development by up to 20%.
  • Wafer Edge Profile Measurement Solution – Leverages industrial automation capabilities for semiconductor front-end processing. 
  • High-Speed, Multi-Die Advanced Packaging Equipment – Utilising Universal Instruments’ strengths, this solution offers quicker back-end processing by up to 3x the industry standard, as well as placement repeatability within 3 micrometres.

“The highly advanced integrated hardware and software solutions presented today highlight Delta's comprehensive expertise in the semiconductor equipment field,” said Andy Liu, General Manager of Delta’s Industrial Automation Business Group (IABG). “Our rapid advancement in AI and digital twin technologies enable the seamless integration of front-end and back-end processes, ultimately ensuring the reliability and optimal performance of our customers' equipment and operations. Moreover, we are also demonstrating how we leverage AI and digital twin technologies to optimise the cybersecurity of semiconductor equipment manufacturers.”

DIATwin Virtual Machine Development Platform

The design and development tool aims to provide automated prototype designs, virtual machine construction, offline process planning, and virtual machine commissioning. When combined with the Wafer Edge Profile Measurement Machine, this solution can help bridge the gap between virtual and physical equipment.

Wafer Edge Profile Measurement Solution

Once crystal growth, slicing, and grinding processes are complete, silicon wafers require a precision edge profile measurement for quality assurance purposes. Delta’s technology utilises non-destructive AOI optical technology to measure wafer notches, flat edges, and chamfers with micro-scale repeatability. A high throughput of around 60-120 wafers per hour is possible. Additionally, the automated robotic loading/unloading and AGV transport systems are supported with this technology.

High-Speed, Multi-Die Advanced Packaging Solution

This solution integrates the FuzionSC Platform with a High-Speed Wafer Feeder to provide semiconductor manufacturers with an area to place passive components and a range of dies on diverse substrates and carriers. With FuzionSC, the system can operate three times quicker than the industry standard, with placement repeatability within three micrometres.