ERS launches the Wave3000 for the metrology and analysis of warped wafers
“Our new equipment offers a high level of flexibility and precision and can measure warpage, bow and wafer thickness, which are critical wafer characteristics to avoid yield loss of broken wafers.”
Thermal management solutions for semiconductor manufacturing provider ERS has launched its latest product for metrology and analysis of warped wafers, the Wave3000. The scanner can measure and analyse warped wafers from 200 to 300mm in less than a minute, with the ability to measure various wafer surfaces and materials, including silicon, mould compound and others.
Key information:
- The Wave3000 combats wafer deformities with highly flexible and precise measurements of warpage, bow and wafer thickness.
- ERS’s latest product can measure and analyse warped wafers from 200 to 300mm in less than a minute.
- Following the measurement process the Wave3000 produces an interactive 3D view of the wafer. The user can rotate and zoom in, allowing the warpage profile to be viewed at any angle.
The Wave3000 features an advanced optical scanning methodology which can measure wafer deformities in specific handling positions. This allows for a comprehensive and precise analysis of the wafer warpage, which ensures the quality of Advanced Packaging devices. The patent-pending measurement methodology allows measurements to be taken on different platforms, including on pins or on an end-effector.
"With the growing adoption of Advanced Packaging technologies, we see that warpage is becoming an increasingly more complex issue in semiconductor manufacturing," says Laurent Giai-Miniet, CEO of ERS Electronic. "It can be caused by a variety of factors, including differences in material properties, temperature fluctuations, and stress during handling and processing. Warped wafers can cause not only process issues but also production issue leading to defects and reduced yield."
Following the measurement process, the scanner produces an interactive 3D view of the wafer. Through the rotation and zoom tools, the user can gain a greater understanding of the warpage behaviour, and its impact on the wafer manufacturing process.
"Our new equipment offers a high level of flexibility and precision and can measure warpage, bow and wafer thickness, which are critical wafer characteristics to avoid yield loss or broken wafers," says Debbie-Claire Sanchez, Fan-out Equipment Business Unit Manager at ERS Electronic. "Wave3000's advanced software generates an accurate 3D map of the wafer surface, so the user can analyse the warpage impact on the wafer's performance and make informed decisions on how to optimise process steps for better results."
This latest innovation from ERS expands the company’s portfolio of automatic, semi-automatic and manual thermal debonding and warpage adjustment equipment for Fan-out Wafer-level Packaging.